Jet Printed Solder Paste and Cleaning Challenges
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In case of broadband technology, component packages and other devices assembled on the PCBs are ever-shrinking, yet demands for quality, precision and reliability remain the same. Thus, how can manufacturers ensure they are sufficiently clean to meet the stringent quality and reliability demands?
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Article number: US-1802-01
Jet Printed Solder Paste and Cleaning Challenges
Within an SMT production process, most industry professionals would agree that solder paste printing is the most critical step. Many of the defects in circuit board assembly, such as excess solder or insufficient solder volumes, are a direct result of the solder paste printing process. Today, the solder paste deposition process is accomplished by printing, dispensing or most recently by jetting.