FAQ: Failure Remediation and Risk Assessment in Electronics Manufacturing
This page summarizes key questions on failure remediation and risk assessment in electronics manufacturing. The focus is on the structured classification of failure modes on electronic assemblies, the selection of suitable test and verification methods, the assessment of relevant risks, and the derivation and verification of effective corrective measures. In addition, typical questions relating to Technical Cleanliness, humidity robustness, and assistance modules are addressed.
Last updated: 26 January 2026
The Most Important Information in Brief
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Failure remediation and risk assessment help to reliably narrow down the causes of failure in electronic assemblies and to comprehensively assess risks to reliability, series production, and field operation.
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For a targeted quotation , initial contact, assembly information, and a structured error description are crucial, as they are used to derive the analysis strategy and effort required.
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Whether analysis can be performed non-destructively depends on access to the relevant location and the method chosen.
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Failures due to moisture and heat stress can be evaluated if test results, boundary conditions, and the affected assembly, including contextual data, are available.
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Discoloration, deposits, and contamination on field returners are systematically classified and, if necessary, verified using suitable analysis methods.
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Technical Cleanliness and particle limits should be derived on a risk basis from the application, critical areas, failure mechanisms, and verification strategy.
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Humidity robustness, protection concepts, and process validation are key components when it comes to permanently reducing risks and verifying measures.
Further links:
SMT manufacturing
Power modules
Failure remediation and risk assessment
Assistance modules
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FAQ Failure assistance & risk assessmentQuick access
Damage repair & risk assessmentWhat information do you need to prepare a quote?
To provide a reliable quote, we need initial contact, assembly information (type of assembly), and a structured description of the fault pattern. From this, we derive the appropriate procedure, the scope of testing, the test plan, and the cost.
a) Failure Analysis
In order to prepare a quote and determine the scope and procedure of the audit, we require:
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Initial contact and objectives: contact person, desired result, e.g., cause, evidence, corrective action, auditability
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Type of assembly: assembly designation, technology, quantity and availability, known materials, coatings, adhesives, encapsulation
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Description of the problem or defect
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Fault pattern, e.g., corrosion, discoloration, short circuit, leakage current, dropouts
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Occurrence, production, testing, or field
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Boundary conditions, voltage, temperature, humidity, media contact
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Available data, images, measured values, test reports
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b) Risk Assessment
To prepare a quote and determine the scope and procedure of testing, we need:
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Initial contact and assessment objective: Focus on field risk, approval decision, process change, audit, supplier communication
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Type of assembly and application context: operating environment, criticality, load profile, required service life
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Focus of the risk assessment
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Functional risk, probability of failure
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Safety or compliance risk
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Reliability over service life, climate, humidity, temperature changes
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Risk due to residues, contamination, material interactions
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Can the test specimen or sample be analyzed non-destructively?
Whether a non-destructive or low-destructive examination is possible is decided on a case-by-case basis. The decisive factors are access to the relevant location and the method used.
What typically determines feasibility
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Access to the relevant location: accessible under components, in gaps, at interfaces, in grouting areas
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Method and objective of the statement: Findings close to the surface, interface evaluations, or material interactions require different approaches
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Condition and availability of the sample: original condition, risk of contamination, comparison samples, number of test specimens
Example of a non-destructive method: Electrical impedance spectroscopy (EIS) can be used to evaluate electrical properties and changes over time. The conclusions that can be drawn depend on the question being asked, the measurement access, and the design of the assembly.
Practical note: If an interface evaluation is required, non-destructive analysis may be limited. In these cases, low-destruction alternatives or coordinated sample strategies are selected.
Can you analyze the causes of failure after moisture and heat testing?
Yes. Failures after moisture and heat exposure can be analyzed if the assembly is available for examination and the necessary background information is available.
Information that significantly speeds up the analysis
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Test conditions: temperature and humidity profile, duration, cycles, voltage conditions, test standard or test setup
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Results: Measurement data, anomalies, time of failure, images, test reports
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Assembly information: Design, materials, protective measures, process history
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Context of use: Application, environment, storage, transport, known media or harmful gases
We see discoloration and contamination on field returners. Can you help us assess and identify the cause?
Yes. Discoloration, deposits, and contamination can result from production processes, cleaning and rinsing processes, material interactions, or environmental influences. A reliable assessment requires contextual data and appropriate analysis.
Typical procedure
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Visual inspection and documentation: microscopy, photo documentation
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Context comparison: operating conditions, climate, media, time sequence
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Selection of suitable test methods: Identification of residues or reaction products, comparison with plausible mechanisms
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Derivation of next steps: Remedial approach, verification, risk classification
Assistance Module Technical Cleanliness
Evaluate particle contamination, minimize risks, develop solutions.
Can you help us with the drawing specifications for purity and technical cleanliness? How can I set particle limits?
Yes. Particle limits and purity levels should be derived on a risk basis from the application, critical areas, failure mechanisms, and verification strategy so that the specification is technically justified, measurable, and can be consistently maintained in the process.
Typical components of a robust specification
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Definition of critical areas and functional surfaces
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Particle types, size classes, limits
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Test method, test scope, documentation
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Interfaces along the process chain: goods receipt, assembly, cleaning, packaging
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Action logic: what happens when findings fall outside the target range
Can you determine whether our assemblies have failed due to the effects of harmful gases?
Yes. An assessment of harmful gas influences is possible if the assembly is available for analysis and relevant background information is provided.
What information is typically required
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Operating environment: industrial atmosphere, storage conditions, transport
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Time course and error frequency
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Known exposures: vapors, emissions, media contact
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Visual findings: corrosion, discoloration, deposits, existing data
Depending on the findings, suitable analyses are used to identify corrosion products, deposits, or typical reaction patterns.
How can you determine whether a failure was caused by Electrochemical Migration, and what information is required to do so?
ECM is typically relevant when moisture, ionic contamination, and electric field strengths interact and conductive structures arise between potentials. For a reliable assessment, boundary conditions, possible ion sources, and the failure pattern must be documented in a comprehensible manner.
Information that facilitates clarification
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Assembly and affected zone, in their original condition if possible
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Operating or test conditions: humidity, temperature, voltage, time
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Documentation: images, measured values, time of failure
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Indications of ion sources: process residues, materials, cleaning and rinsing processes
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Protective concepts: coating, encapsulation, sealing, housing
Depending on the issue, suitable analyses are selected to identify residues, evaluate structures, and derive a comprehensible causal logic.
How do you assess the humidity robustness of assemblies and power modules?
Humidity robustness becomes relevant when assemblies are used under climatic influences, condensation, or changing operating conditions. Evaluation and validation are based on the stress profile, material system, surface condition, residues, and protection concepts, as well as on suitable evidence.
What information is typically required for this
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Application profile and stress conditions: temperature, humidity, cycles, stresses
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Material and design: Printed circuit boards, assembly design, protection concepts, coatings, encapsulation, seals
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Residue profile and potential ion sources
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Existing tests and results: climate stress, failure times, images, measured values
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Purpose of the evaluation: Approval, risk reduction, cause analysis, verification of measures
What makes our troubleshooting modules special
Remediation modules combine practical know-how with structured support for specific issues. They are suitable for troubleshooting failures and anomalies as well as for securing processes, for example in process validation, approvals, or changes.
What is typically included in remediation modules
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Practical input and knowledge transfer, tailored to the specific application
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Structured exchange on failures, anomalies, and boundary conditions, including classification of possible causes and risks
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Derivation and evaluation of remedial approaches, including prioritization and implementation recommendations
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Support for process validation, for example in process validation, process windows, verification logic, or documentation for internal and external requirements
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Optional integration of suitable test and verification modules if verification is required
When remedial modules are particularly useful
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Recurring anomalies or unclear error patterns where simply "obtaining findings" is not sufficient
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When experience-based knowledge is needed for classification, evaluation, and process validation
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For changes, start-ups, or validation issues where risks need to be reduced in advance
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When the goal is to communicate causes and measures in a comprehensible manner, for example to customers or auditors
How do you handle confidentiality, NDAs (non-disclosure agreements), and data?
Confidentiality is a matter of course for us. We will sign an NDA upon request. In addition, we work according to established management systems and standards to ensure structured and secure handling of information and data.
What this means in practice
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NDA: An NDA is possible at any time and can be concluded before the exchange of documents, images, or test specimens.
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Certifications: We are certified according to ISO 9001 and ISO 27001.
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TISAX©: We also have the TISAX label.
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Data and documents: Results, documentation, and image material are used exclusively within the agreed framework and are not passed on to third parties.
Here you can access our knowledge hub with current challenges from the industry and practical solutions.
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Further training from experienced experts. Training courses and seminars at the ZESTRON Academy
contact Failures, Assess Risks, Verify Remedies
Define the next steps—from technical discussions about error patterns and operating conditions to suitable testing and verification modules to the implementation and validation of effective corrective measures.