HYDRON® SE 230A

Your Benefits HYDRON® SE 230A

A water-based, single-phase cleaning agent specifically developed for the use in immersion and ultrasonic processes. HYDRON® SE 230A removes flux residues from a wide range of PCB and semiconductor electronics, such as leadframes, discrete devices, power modules, power LEDs, flip chips, and CMOS following the die attach process. The product also is capable of removing coating residues from pallets, fixtures, tools and PCBs.

• Excellent material compatibility 
  The pH neutral design provides excellent material compatibility, specifically with power modules and die surface passivization which includes aluminum, copper, etc. Also compatible with OSP surface finish
• Low surface tension
  Features very low surface tension, ideal for cleaning capillary spaces, such as underneath low stand-off components
• Ideal for subsequent processes
  The pH neutral formulation results in stain-free activated copper surfaces for subsequent processes such as wire bonding (gold and aluminum), molding and adhesive bonding.
• Eliminates risk of reoxidation
  Retains activated copper surfaces over an extended period of time without risk of reoxidation
• Low cost solution for an automative cleaning process
  Using Hydron® SE 220 will ensure reliable cleaning underneath components at a low start up cost, ideal for Class 3 assemblies.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.