Corrosion in Power Electronics
Dr. Markus Meier
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Brief Insight
Corrosion in electronic assemblies and power modules is one of the key factors affecting reliability. In power electronics in particular, the anodic migration phenomenon, or AMP, frequently occurs under high voltage and high humidity conditions. Using specific failure cases, the whitepaper explains how AMP differs from the well known mechanism of electrochemical migration and why the growth direction of dendritic structures changes.
Delivery form: PDF
Article number: EN-2604-03
Whitepaper
Corrosion in Power Electronics
Abstract
Corrosion on electronic and power electronic devices is one of the major effects, which negatively affect the reliability of the respective device. The ZESTRON experience from over many years of failure analysis and risk assessment in this area clearly reveal that in power electrics especially the anodic migration phenomenon (AMP) is the corrosion mechanism most often found under high voltage conditions in combination with high humidity load.
This study shows that the AMP is a deviation from the “basic mechanism” electrochemical migration, which is commonly known from low voltage applications. When occurring in power electronic devices, this failure mechanism changes from a cathodic-anodic migration phenomenon to an anodic-cathodic one especially in and under polymer materials used e.g. for isolation purposes. Based on actual failure cases, it will be explained in detail why this change in growing direction of the optically visible dendritic structures happens.
Key Topics
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Overview failure mecheanisms
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Electrochemical Migration (ECM) - the "basic mechanism"
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Anodic Migration Pheneomen (AMP)
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AMP case studies
Category: Power ELectronics | Request: Bookmark this
Dr. Markus Meier
Group Leader Reliability & Surfaces
After his study of chemistry at the Technical University Munich, Markus Meier worked among others on the ageing of cement and earned a PhD on the topic crystallization of cement-hydrate-phases under microgravity conditions. He is experienced in the areas interfacial chemistry and surface analytics. He is part of the Reliability & Surfaces Team in which he is responsible for the coordination of research projects as well as the organization of technology coachings.
