ATRON® AP 125A

Your Benefits ATRON® AP 125A

Water-based cleaning agent specifically developed for the removal of water soluble fluxes from various package types such as flip chip BGAs including 2.5D/3D TSV stacks, BGAs and SiP. It provides a high level of material compatibility with sensitive metals and is recommended for inline and batch spray-in-air cleaning processes.

• Excellent cleaning performance, especially suitable for low-standoffs
  The cleaning agent provides an excellent cleaning performance in the removal of water soluble fluxes from flip chip BGAs, BGAs and SiP. It is especially suitable for packages with low standoffs (<50), fine bump pitch (<150) and µ-bumps (20-80µm).
• Very good rinsability & optimal conditions for subsequent processes
  The cleaner provides very good rinseability under components to ensure optimal conditions for subsequent underfilling, wire bonding and molding, thereby preventing voids, delamination and poor bonding quality.
• Excellent material compatibility
  The product is compatible with any typical packaging material and especially with sensitive metals, such as Al and Cu, as well as organic and inorganic chip passivations.
• No flash point
  The product has no flash point and provides very good worker health and safety.
• Concentration measurement
  The BRIX measurement can be used for a fast check on cleaner concentration.