Electrochemical Migration – How Field Failures Occur and How to Avoid Them – Part I
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[Dr. Helmut Schweigart; Sandra Pilz]
Electrochemical migration (ECM) is an important topic in terms of the reliability and life span of electronic components. Read how fiel failures occur and how you can avoid them.
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Article number: EN-1609-01
Electrochemical Migration – How Field Failures Occur and How to Avoid Them
– Part I
Electrochemical migration (ECM) is an important topic in terms of the reliability and life span of electronic components, and is repeatedly discussed as the possible trigger for field failures. Due to the ever increasing requirements in terms of greater packing densities/miniaturisation as well as external environmental influences, focus is being placed on field failures triggered by humidity or impurities, particularly in components that are exposed to changing environmental influences.
Dr. Helmut Schweigart
Head of Reliability & Surfaces, ZESTRON Europe
Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz - a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation - an environmental simulation company) and of the IPC. He has already published numerous technical articles.
Sandra Pilz
Group Leader Product Management, ZESTRON Europe
Sandra Pilz has been working in product management at ZESTRON for more than 15 years and is responsible for the fields of component cleaning, power electronics and advanced packaging as well as for the global coordination of product management. In addition to product development in Europe, she oversees the activities of the local teams in North Asia, South Asia, Japan and the USA. In addition, she organises ZESTRON's trade fair appearances at SMT and Productronica and contributes to various technical articles.