SMT Stencil Underside Cleaning: Cleaner Stencils, More Stable Printing

A clean stencil is essential for stable and precise solder paste printing – and therefore for a reliable SMT process. Regular cleaning of the stencil underside directly in the SMT printer plays a key role in this. When properly implemented, it helps maintain consistent print quality and prevent defects in subsequent production steps.

Details

At a glance

Date

Fri, 16.10.2026 , 03:00PM-03:45PM (IST, Indian Standard Time)

Format

Live Online Webinar

Fee

Free of charge

Your contact

Description

What to Expect

Solder paste residues on the stencil underside can affect print quality and process stability during SMT printing. Reliable underside cleaning between print cycles, directly in the printer, is therefore an important part of maintaining a stable printing process.

In this webinar, you will gain a concise overview of the key factors influencing stencil underside cleaning and learn how to systematically evaluate and optimize your existing process.

Why You Should Join

Understand the importance of reliable stencil underside cleaning for a stable SMT printing process.
Identify optimization potential and key parameters in your existing cleaning process.
Learn about the process-related advantages of specially formulated underside cleaning agents compared with IPA.
Benefit from compact expert knowledge in a time-efficient format.

Who Should Attend

Engineers, technicians, quality managers, production managers, and process owners involved in PCB manufacturing and cleaning processes who aim to improve cleaning performance and product reliability.

Which types of residues can occur on the stencil and its underside and how they can affect solder paste printing and subsequent SMT production.
Cleaning wipe, cleaning agent, solder paste, and printer: how these factors interact and where there is potential for process optimization.
Why switching from IPA to a specially formulated water-based or solvent-based underside cleaning agent can be beneficial and what to consider for a successful transition.
The role of material compatibility and printer manufacturer approvals when selecting a cleaning agent.
The limitations of stencil underside cleaning compared with automated stencil cleaning.