assemblies risk assessment impurities

Procedure for the Risk Assessment of Impurities


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[Dr. Helmut Schweigart]

Review and assess potential risks associated with contamination of low power devices.

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Article number: EN-2206-04


PCB Production / Analytics

Procedure for the Risk Assessment of Impurities


Increasingly, the application of low-power components and the resulting low switching thresholds make it relevant to check materials and processes for the production of electronic assemblies also with regard to potential risks from contamination.

The challenges to the established approaches arising from the sensitive switching thresholds of the low-power components, their limitations and a proposal for improving the situation are presented in this technical article.

Surface cleanliness Zestron Schweigart | © @The Sour Cherry Fotografie - Michaela Curtis

Dr. Helmut Schweigart

Head of Reliability & Surfaces, ZESTRON Europe

Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz - a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation - an environmental simulation company) and of the IPC. He has already published numerous technical articles.