Quality Test for Susceptibility of Encapsulated Power Electronics to Harmful Gas Corrosion and Humidity
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[Dr. Markus Meier]
Cracks, but also penetration weak points in molds and pottings of low voltage electronics and power electronic devices result in a drastic shortening of the service life or, in most cases, the immediate failure of the entire circuit.
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Article number: EN-1910-04
PCB Production / Analytics / Coating
Quality Test for Susceptibility of Encapsulated Power Electronics to Harmful Gas Corrosion and Humidity
Cracks, but also penetration weak points in molds and pottings of low voltage electronics and power electronic devices result in a drastic shortening of the service life or, in most cases, the immediate failure of the entire circuit. Particularly, in the case of ambient air with a high content of harmful gases or humidity, faulty spots in molds and pottings must be viewed very critically, as this enables direct access of the corrosive gases and humidity to the susceptible metal pieces of the components and circuits (DCB and chip surfaces, solder/sinter connections, …).
In order to test the reliability of electronic components and circuits and thus the tightness of the mentioned protective systems against corrosive gases, harmful gas tests with different gases or gas mixtures such as sulphur dioxide, hydrogen sulphide, nitrogen oxides or chlorine are currently being carried out.
Dr. Markus Meier
Group Leader Reliability & Surfaces, ZESTRON Europe
After his study of chemistry at the Technical University Munich, Markus Meier worked among others on the ageing of cement and earned a PhD on the topic crystallization of cement-hydrate-phases under microgravity conditions. He is experienced in the areas interfacial chemistry and surface analytics. He is part of the Reliability & Surfaces Team in which he is responsible for the coordination of research projects as well as the organization of technology coachings.