InsightsReducing Water and Energy Consumption in PCBA Cleaning
How rinsing concept, cleaning medium, process temperature and bath maintenance influence resource consumption and the cost-effectiveness of cleaning processes.
— PROCESS EFFICIENCY IN ELECTRONIC ASSEMBLY CLEANING Using Water, Energy and Cleaning Media Efficiently
In the cleaning of electronic assemblies, many process parameters affect the consumption of water, energy and cleaning media. These include the system concept, rinsing process, process temperature, bath maintenance and service life of the cleaning medium.
For electronics manufacturers, this means that a cleaning process must not only reliably achieve the required cleaning performance, but also operate under stable and cost-effective process conditions. A technical assessment of the entire process is therefore essential, from the selection of the cleaning medium and system configuration through to regular monitoring of the cleaning bath.
ZESTRON supports the assessment and optimization of these influencing factors. The aim is to design a cleaning process that fits the specific electronic assembly, residues, throughput and production requirements.
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— PCBA CleaningMeasures for More Resource-Efficient Cleaning Processes
There are several approaches to designing the cleaning of electronic assemblies in a more resource-efficient way. These include process control, the cleaning stage and the rinsing stage.
Even when selecting a cleaning system, it is possible to consider how the cleaning and rinsing processes are designed and what options are available to reduce water, energy and media consumption.
Adsorbers for filtering heavy metals
Adsorbers can remove heavy metals from the cleaning bath and thereby extend the service life of the cleaning medium.
Closed-loop system
A closed-loop system enables the treatment and reuse of rinse water and can support a wastewater-free rinsing process.
Selection of a water-based cleaner
Depending on the application, water-based cleaners can be an alternative to solvent-based cleaners and support process design with regard to media handling, VOC content and bath life.
Reduction of process temperatures
Lower process temperatures can reduce the energy required for heating and maintaining cleaning media, provided that the required cleaning performance continues to be reliably achieved.
— PCBA CleaningMeasures at a Glance
The measures mentioned above are described in more detail below to show their respective benefits and possible applications in the cleaning process for electronic assemblies.
— adsorbers Heavy Metal Removal with Adsorbers
Cleaning media used in the cleaning process remove residues such as flux and particles from electronic assemblies. These contaminants then enter the cleaning bath of the system. In addition, metal ions can dissolve in the cleaner and rinse water from metal surfaces such as solder joints, solder deposits, terminals or heat sinks.
At high throughputs, relevant ion concentrations can build up in the process circuits over time. An adsorber integrated into the cleaning circuit can selectively remove heavy metal ions such as copper, tin, lead, iron, zinc, nickel, antimony or bismuth. This supports bath maintenance and helps extend the service life of the cleaning medium.
— Cleaning Systems Resource Efficiency through Closed-Loop Systems
When cleaning electronic assemblies, the choice of rinsing system plays a decisive role in water consumption, wastewater volume and operating costs. A basic distinction is made between open-loop and closed-loop systems.
In an open-loop system, the rinse water is discarded after each rinsing step and discharged directly into the sewage system. This requires special approval and leads to high water consumption as well as a corresponding wastewater volume.
Closed-loop systems offer a resource-efficient and cost-effective alternative. In this process, the used rinse water is treated within the system and returned to the process. Mixed-bed resin and activated carbon cartridges are used to remove organic contaminants and salts. This enables an almost wastewater-free rinsing process and can significantly reduce water consumption.
Our engineers support you in developing a suitable rinsing and cleaning concept for your requirements.
— cleaning chemistry Water-based Cleaners for Electronic Assemblies
Water-based cleaning processes have not only replaced the flammable solvents that were commonly used in the past due to a lack of alternatives, but have also become a new standard in recent years. VIGON© products with innovative MPC® Technology support high-performance and more resource-efficient cleaning of electronic assemblies.
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Halogen-free: Water-based cleaners do not contain halogens that could enter the environment and have harmful effects.
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Low VOC content: Water-based cleaners are characterized by a low content of volatile organic compounds, or VOCs.
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Excellent bath lifetimes: Thanks to their efficient filterability, water-based cleaners can be used for longer periods. This supports extended bath life and can reduce ongoing process costs.
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Low operating temperatures: Cleaners based on MPC® Technology can deliver their full performance at operating temperatures starting from 40 °C.
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No fire hazard: Water-based cleaners have no flash point and are therefore safer to handle.
When selecting the right cleaning medium, material compatibility with the components of your electronic assembly and the desired cleaning result should be considered together with process temperature, bath life and filterability.
This makes it possible to design a cleaning process that operates reliably, enables long service life of the cleaning medium and reduces ongoing costs.
— Expert GuidanceDesign Your Cleaning Process with Confidence
Would you like to evaluate water consumption, bath life, cleaning medium or process temperature in your cleaning process? ZESTRON supports you in selecting suitable cleaners, assessing cleaning system and rinsing concepts, and designing a stable cleaning process for electronic assemblies.
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