VIGON® PE 215N

Your Benefits VIGON® PE 215N

Water-based, pH-neutral MPC® cleaning agent for reliable removal of flux residues from power electronics parts. It is especially suitable for the cleaning of power modules/DCBs, e.g. after die attach and heatsink soldering. The product was specifically developed for the use in spray-in-air equipment, but it can also be used in ultrasonic dip tanks machines.

• Optimum copper surfaces for subsequent processes
  The product provides stainless, activated copper surfaces for subsequent processes such as wire bonding, moulding and adhesive bonding. Moreover, it retains activated surfaces over a temporary storage time.
• Excellent material compatibility
  The pH-neutral formulation results in an excellent material compatibility, specifically with dies. No attack of passivation occurs.
• Very good rinsability
  The product is characterised by very good rinsability, the rinsing does not lead to reoxidation of the copper surfaces.
• No flash point
  The cleaning agent has no flash point and no foaming, and is thus applicable in all spray-in-air equipment without explosion proof.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.