VIGON® UC 160

Your Benefits VIGON® UC 160

Water-based cleaning agent specifically designed to remove solder paste from stencils in SMT printers. It effectively removes the latest lead-free & lead-based solder pastes.

• Effective solder paste removal & printing after wait
  Effective removal of solder pastes from stencils in underside wiping, even out of fine pitch apertures. The cleaner is specifically suitable for print after wait.
• Excellent wetting ability
  The cleaning agent provides excellent wetting ability on stencils and therefore increased cleaning performance, which significantly reduces smearing on the stencil underside. Thus bridging of solder paste on the boards can be avoided.
• Good delineation stability
  Good delineation stability further ensures reduced solder balling.
• High operational safety
  High operational safety and ideal replacement for Isopropanol due to excellent health and safety characteristics, no flash point, low VOC level, low odor.
• Approval by leading international manufacturers
  The product has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained.