for professionals. by professionals.2024 Webinar Series
ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series.
Advancements in Solder Paste Printing: Cleaning Compatibility of Jettable and Screen-Printable Solder Pastes in Advanced Electronic Assemblies
May 16th - 2:00 PM EST
Join ZESTRON Academy’s Kalyan Nukala, along with Evan Griffith of Indium Corporation, while they dive into the widespread adoption of solder paste jetting in the context of miniaturization and intricate electronic assemblies. The webinar will critically analyze the cleaning compatibility between jettable and screen-printable solder pastes, encompassing formulations, reflow, and cleaning characteristics. The study incorporates four solder pastes, employing different cleaning chemistries and adhering to IPC standards for visual inspection, ion chromatography, and SIR testing. Attendees will gain insights into the best and worst-case cleaning scenarios, unveiling key findings for optimal process efficiency.
Overcoming the Challenges for Implementing IPC J-STD-001 in Your Factory
June 13th - 2:00 PM EST
Join Dr. Denis Barbini as he explores the impact of process changes on product reliability in accordance with IPC-J-Std-001 Rev H. Learn how changes in materials require objective evidence and discover the importance of acquiring quantitative data, using tools like SIR, Ion Chromatography, and Rose testing, to assess and mitigate risks before implementing process changes.
Optimizing Removal of Conformal Coating Residues: Efficient, Cost-effective, and Safe Methods
August 22nd - 2:00 PM EST
Explore efficient, cost-effective, and safe method for removing conformal coating residues from pallets, fixtures, and tools with Andrés Turrubiates from ZESTRON Academy. Delve into case studies as Andrés shares valuable perspectives on selecting the right equipment, cleaning agents, and details for replacing risky practices such as using hazardous chemicals and hand chiseling.
Surface Reliability: Overcoming Challenges in SMT PCB Manufacturing and Determining Root Causes for Improved Performance
September 5th - 2:00 PM EST
Join Dr. Denis Barbini, an industry expert, as he explores strategies to enhance surface reliability and identifies root causes that impact performance. Gain valuable insights into overcoming obstacles and optimizing processes to ensure optimal performance in SMT PCB manufacturing. Don’t miss this opportunity to elevate your understanding and skills.
Electrifying Reliability: Advanced Cleaning and Coating Solutions for Enhanced Performance in E-Mobility
October 17th - 2:00 PM EST
Discover the future of E-Mobility as ZESTRON Academy’s Jeff Kennedy and Brent Frizzell of Specialty Coating Systems team up for an enlightening webinar. The webinar will review the latest advancements in enhancing the reliability of electronic components in the rapidly evolving landscape of E-Mobility. Dive into advanced cleaning and coating solutions designed to elevate performance and address common failure causes. Gain a comprehensive understanding of how advanced cleaning and coating solutions play a pivotal role in mitigating failure risks and optimize the performance of electronic components in the E-Mobility sector. Don’t miss this opportunity to stay at the forefront of innovation and ensure the reliability of electronic systems in the electrified future of transportation.
Elevating Efficiency: Maximizing Efficacy for Cost Savings and Increased Capacity in Cleaning Processes
November 21st - 2:00 PM EST
Join ZESTRON Academy’s John Neiderman for expert insights on cleaning process optimization. Discover cost reduction and increased capacity for Contract Manufacturers through equipment selection, chemical usage, and process settings. Benefit from John’s industry experience to ensure maximum operational efficiency and reliability. Don’t miss out – register now for actionable strategies!
Advanced Packaging and Power Electronics:A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges
ZESTRON Academy is proud to present the Advanced Packaging and Power Electronics webinar series! This is a free educational opportunity providing valuable knowledge on the latest advancements and trends within the Advanced Packaging and Power Electronics sector. This series is an excellent way to stay up-to-date and enhance your understanding of semiconductor materials, processes, and equipment.
Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges
May 23, 2024, 2:00 PM EST
Join Sr. Applications Engineer, Ravi Parthasarathy, as he examines the complexities of High Bandwidth Memory (HBM) wafers, focusing on critical cleaning intricacies essential for surface treatment. Primary emphasis will be placed on the significance of surface preparation for sustained reliability and performance and include discussion on key challenges such as the complexities of delicate structure, chemical compatibility, residue elimination, and precise process control. In conclusion, the presentation summarizes the cleaning challenges and recommended best practices essential for optimized surface treatment of HBM wafers.
Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
June 11 2024, 2:00 PM EST
Residues from flux pose a common obstacle in the cleaning of power electronics components, potentially leading to corrosion, electrical shorts, and reliability issues that impact component performance and lifespan. Adhering to optimal cleaning practices is crucial in overcoming this challenge. Join Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, as he offers insight into the evolution of power electronics. He will delve into the selection of appropriate cleaning methods, ensuring compatibility with components, and validating cleaning effectiveness. Ravi will also discuss various test methods for assessing the cleanliness of power electronics components, supported by case studies illustrating successful cleaning approaches for complex component packages.
Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs
July 18, 2024, 2:00 PM EST
Join Sr. Applications Engineer Ravi Parthasarathy for a webinar on heterogeneous integration in semiconductor technology. Learn about the transition from Chip on Substrate (CoS) to Chip on Wafer (CoW) technology, which integrates chips onto an interposer with wafer-level molding and flip chip (FC) substrate connection.
Ravi will discuss his research presented at IMAPS Device Packaging Conference 2023, focusing on ultra-fine pitch CoW devices with bump pitches under 25μm and over 150K bump counts. Discover the efficacy of low concentration alkaline cleaning agents compared to de-ionized water inline systems. Learn about the impact of wash temperatures and conveyor belt speed on cleaning effectiveness through visual inspection, FTIR analysis, and SEM/EDX testing.
Don't miss this webinar for insights into heterogeneous integration and advanced cleaning techniques in semiconductor technology.
Advancing Reliability in Automotive Power Electronics: Cleaning Strategies and Corrosion Mitigation
August 15, 2024, 2:00 PM EST
Flux residues present considerable challenges for automotive power electronics, potentially resulting in corrosion, electrical shorts, and reliability issues. Join Ravi Parthasarathy, Sr. Applications Engineer, as he reviews how to mitigate these risks utilizing effective cleaning practices. Ravi will examine the evolution of power electronics in the automotive sector and addresses the mounting concern of corrosion-induced failures, such as electrochemical migration (ECM) and anodic migration phenomenon (AMP), delving into the causes of these failures and proposes mitigation strategies. Various techniques for assessing component cleanliness via case studies demonstrating successful cleaning of complex automotive component packages will be reviewed as we dive into the challenges associated with sintering technology in automotive applications and suggest effective mitigation approaches. Attendees will benefit from valuable insights into enhancing the reliability of automotive power electronics systems.