InsightsFrom an HFE Process to Water-Based Electronics Cleaning
How a water-based cleaning process can help reliably remove visible flux residues, reduce process costs and improve the long-term viability of electronic assembly cleaning.
— PROCESS Transition IN ELECTRONIC ASSEMBLY CLEANING When an HFE Cleaning Process Needs to Be Rethought Economically
Existing HFE cleaning processes can deliver reliable results for demanding electronic assemblies. At the same time, high media costs, increasing requirements for resource efficiency and the long-term availability of cleaning media can lead companies to reconsider their existing cleaning process.
In this project, the key question was whether visible flux residues on double-sided assemblies could also be reliably removed using a water-based cleaning process. The focus was not only on cleaning performance, but also on whether the process parameters, economic viability and process reliability would fit the existing production environment.
ZESTRON supported the technical assessment with practical cleaning trials in the Technical Center. Cleaning results, process conditions and the suitability of a water-based alternative to the existing HFE process were evaluated.
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— Initial situation HFE Process With High Costs and Limited Long-Term Perspective
The existing cleaning process was based on HFE and was technically established. At the same time, two factors were becoming increasingly important: high process costs and the upcoming end of the life cycle of the cleaning system in use.
This placed the customer in front of a strategic process decision: Should the existing HFE process be continued, or would switching to a water-based cleaning process be technically and economically viable?
Cleaning quality was a critical factor. The electronic assemblies were populated on both sides and showed visible flux residues. An alternative process was therefore only an option if these residues could be reliably removed and the new process fit the existing production environment.
The goal was to create a reliable basis for the next steps in process development, taking into account cleaning quality, process costs, resource use and long-term feasibility.
— Test Series in the Technical CenterPractical Cleaning Trials With Defined Process Parameters
To assess the suitability of a water-based alternative to the existing HFE process, practical cleaning trials were carried out in the ZESTRON Technical Center. The key question was whether visible flux residues on double-sided electronic assemblies could be reliably reduced or removed.
01 | Test Objects
Untreated, double-sided electronic assemblies from the customer’s production.
02 | Objective of the Test Series
Significant reduction or removal of visible flux residues on the electronic assemblies.
03 | Tested Cleaning Agent
VIGON® A 201 as a water-based cleaning medium.
04 | Evaluation of the Resultse
The cleaned surfaces were inspected using a digital microscope at 20x to 100x magnification. This made it possible to directly compare visible residues and cleaning effects with the initial condition.
05 | Test Setup
Trial 1: Batch Spray-in-Air at 55 °C, cleaning time: 15 minutes.
Trial 2: Batch Spray-in-Air at 55 °C, cleaning time: 30 minutes.
06 | Test Results
The before-and-after images showed a clearly visible cleaning result. Under the selected process conditions, the visible flux residues on the test assemblies were removed.
This result is particularly relevant because the PCBs were populated on both sides with SMD and THT components and also included reworked areas. This was therefore not a simple standard cleaning task, but a demanding cleaning challenge with strong practical relevance.
The test series provided the customer with a reliable basis for further pursuing the water-based cleaning process as an alternative to the previous HFE process.
— Result DocumentationCleaning Results in a Before-and-After Comparison
The image documentation shows the cleaning effect on two demanding areas of the test assemblies: a fine-pitch area and a reworked assembly with visible flux residues.
Before Cleaning
Clear flux residues are visible in the fine-pitch area.
After Cleaning
No residues are visible in the fine-pitch area after cleaning
Before Cleaning
The reworked assembly shows substantial flux residue amounts
After Cleaning
Almost no residues are visible on the reworked assemblies after cleaning
— Result assessmentWater-Based Cleaning Process as a Suitable Alternative
The cleaning trials showed that the combination of Batch Spray-in-Air cleaning and the water-based cleaning medium VIGON® A 201 was suitable for the assemblies tested. Under the selected process conditions, the visible flux residues on the test assemblies were removed.
This provided the customer with a reliable basis for deciding on the next steps in process development. The water-based process approach demonstrated that cleaning quality, process reliability and economic requirements can also be achieved outside the previous HFE process.
— Your Next StepAre You Evaluating an Alternative to Your Existing Cleaning Process?
Briefly describe your requirements and current cleaning situation. ZESTRON supports you in assessing cleaning quality, process parameters and possible water-based alternatives from a technical perspective.
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