VIGON® PE 200

Your Benefits VIGON® PE 200

Water-based, pH-neutral MPC® cleaning agent which reliably removes flux residues from leadframes, discrete devices, power modules and power LEDs, i.e. after die attach or heatsink soldering. The cleaning agent shows an excellent ability to remove oxide layers from copper surfaces. It is specifically developed for the use in spray-in-air equipment.

• Increased wire bonding/molding quality
  The product provides stainless, activated copper surfaces for subsequent processes such as wire bonding, moulding and adhesive bonding. Moreover, it retains activated surfaces over a temporary storage time.
• Excellent material compatibility
  The cleaning agent is pH-neutral, therefore provides excellent material compatibility, specifically with dies, no attack of the passivation.
• Very good rinsability
  Due to its MPC®- formulation, the product can be effectively rinsed. It does not foam and has a low odor.
• No flash point
  The cleaning agent has no flash point and thus can be applied in all spray-in-air equipment without explosion proof.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.
• Cleaning agent regeneration
  During the use of VIGON® PE 200, the ZESTRON® adsorber HM1 can remove heavy metals from the cleaning bath.