VIGON® PE 216A

Your Benefits VIGON® PE 216A

Water-based, alkaline MPC® cleaning agent with excellent performance in the removal of fluxes, organics and processing fluids from power modules and corresponding stamping grids/leadframes & heat sinks. The product was specifically developed for the use in spray-in-air equipment, but it can also be used in ultrasonic dip tanks machines.

• Excellent cleaning performance for power modules, stamping grids & heatsinks increasing yield
  The cleaner is recommended for power modules (DCB/AMB), i.e. after die attach by soldering or sintering, as well as for cleaning and preparation of stamping grids/leadframes and heat sinks for the attachment to the power module by friction welding or soldering. The cleaner ensures optimal quality for these attachment processes and for molding and thus increases yield.
• Optimum copper surfaces for subsequent processes
  The cleaning agent provides stain-free, activated copper surfaces and therefore optimal conditions for subsequent processes such as wire bonding, molding, and further attachment processes of the power module with stamping grids/heatsinks by friction welding, sintering or soldering. Furthermore, it retains activated copper surfaces over an extended period of time without risk of reoxidation.
• Excellent material compatibility
  Very good material compatibility, specifically with dies and sensitive metals, no attack of the passivation.
• No flash point
  The cleaning agent has no flash point and no foaming, and is thus applicable in all spray-in-air equipment without explosion proof.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 10 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.