ZESTRON® CO 150

Your Benefits ZESTRON® CO 150

The solvent-based cleaning agent is developed for the use in ultrasonic dip tank processes. It can be used undiluted as a pre-cleaner or as a Co-solvent mixture in combination with a HFE-agent. The product is especially suitable for removing flux residues from leaded as well as lead-free NoClean solder pastes from electronic assemblies, power modules and leadframe-based discrete components.

• Optimal cleaning performance
  Very good cleaning results with lead-based and lead-free solder pastes.
• Stable process, broad concentration window
  Guarantees a stable cleaning process as it minimizes boiling retarding and opens a broader concentration window for process control.
• Minimising HFE consumption
  Stabilizes the cooling zone and helps to minimize the HFE consumption.
• Quick drying, low ionic contamination values
  In combination with a HFE-process, the product enables a completely water-free cleaning process and fast residue-free drying. Low ionic contamination values can be achieved despite the water-free process.
• Increased wire bonding/molding quality
  The product creates optimal surface properties for subsequent wire bonding/molding processes for power modules and leadframe-based discrete components.