ZESTRON® SD 301

Cleaning medium for the removal of solder pastes, SMT adhesives and thick film

Contact

Zestron Europe building.
Your Contact

ZESTRON EUROPE

Phone

+49 (0) 8453 / 41995318

Find your local sales and distribution partner

Contact

Your Benefits ZESTRON® SD 301

Solvent-based cleaning agent for the removal of solder pastes, SMT adhesives as well as thick film pastes from stencils and screens in explosion-proof spray-in-air systems. It can also be used to clean misprinted assemblies. Its high flash point also allows the manual use and the application in printers.

  • Wide field of application
    Due to its wide process window, the product reliably removes a wide range of solder pastes, SMT adhesives and resistor pastes from stencils and screens as well as flux residues from misprinted assemblies.
  • Long bath life, low costs
    The product is characterised by its high bath loading capability and a long bath life as well as low cleaning costs.
  • Short process times
    The product facilitates short process times due to superior drying characteristics. It is applicable at ambient temperature.

Product features

Stencils & Screens

Underside wiping

Solvent