02 | Can the Use of No-Clean Solder Pastes Replace Cleaning of Electronic Assemblies?

Find out more about the essential importance of thorough cleaning for the reliability of electronic assemblies.

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No-clean solder pastes were developed to avoid the cleaning step after soldering. The hygroscopic flux activators - contained in the flux - are supposed to be 'encapsulated' during the soldering step.

But can these NoClean pastes deliver what they promise? Find out the answer in the video.

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