PCBs Shadowing Batch Cleaning Systems

Shadowing in Batch Cleaning Systems

Christoph Karl


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Brief Insight
Cleaning electronic assemblies under soldered components with low stand-off heights of 40 μm is a major challenge. This study introduces a non-destructive test using transparent assemblies to investigate shadowing phenomena in single-chamber spray-in-air systems and derive recommendations for process development.

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Article number: EN-2403-02


White paper

Shadowing in Batch Cleaning Systems

Abstract

Cleaning electronic assemblies under soldered components with low stand-off heights of 40 μm is considered a major challenge for cleaning processes, where the general aim of such process is the complete removal of flux residues. Flux residues after insufficient cleaning under components with low stand-off heights could so far only be detected by removing the components and therefore destroying the assembly.

In this study a specially developed non-destructive test with transparent assemblies is presented and used for measurement of possible shadowing phenomena spray in air (SIA) batch cleaning machines.

Specific differences in the cleaning behavior of different machine types with regard to shadowing and depending on the position in individual machines were determined and recommendations for process development were derived.



Key Topics

  • Machines for cleaning processes

  • Types of relative movement

  • Positioning of items in cleaning machines

  • Experimental setup and results

 


Category: PCBA Cleaning | Request: Bookmark this | Shadowing in Batch Cleaning Systems: Check the Fact

Christoph Karl

Project Engineer Applied Research, ZESTRON Europe

Christoph Karl studied Mechanical Engineering with a specialization in Materials Engineering, earning a Dipl.Ing. degree. He then worked at the University of Birmingham and in the automotive supply industry.

At Zestron, he is active in the Applied Research Group, where he oversees topics and research projects related to metrology, analytics, plant engineering, and Design of Experiment (DoE).

In the Applied Research Group, he collaborates with R&D and application technology to develop new methods for analyzing cleaning under components and presents results in a highly targeted manner.

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